PURPOSE: A thermosetting resin composition for a high speed transmission circuit board is provided to show excellent dielectric properties, as well as high glass transition temperature, thermal resistance post absorbing moisture, insulating reliability, adhesiveness to foil, workability, dispersibility of inorganic filler, and electrical properties. CONSTITUTION: The thermosetting resin composition comprises (a) 100 parts by weight of a cyanate ester-based resin having at least two cyanate groups in one molecule; (b) 50-300 parts by weight of a dicyclopentadiene-based epoxy resin; (c) 0.5-10 parts by weight of a fumed silica, based on 100 parts by weight of the cyanate ester-based resin and the dicyclopentadiene-based epoxy resin, (d) 5-100 parts by weight of a thermoplastic resin; (e) 5-300 ppm of a cyanate ester resin curing accelerator; (f) 0.05-3 parts by weight of an epoxy resin curing accelerator, based on 100 parts by weight of the dicyclopentadiene-based epoxy resin; (g) 1-30 parts by weight of a monovalent phenol compound; and (h) 5-50 parts by weight of a flame retardant, based on 100 parts by weight of the cyanate ester-based resin and the dicyclopentadiene-based epoxy resin.
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