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首页> 外文期刊>Physics of the solid state >Influence of defects in a silicon dioxide thin layer on the processes of silicidation in the Fe/SiO2/Si(001) system
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Influence of defects in a silicon dioxide thin layer on the processes of silicidation in the Fe/SiO2/Si(001) system

机译:二氧化硅薄层中的缺陷对Fe / SiO2 / Si(001)体系中硅化过程的影响

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摘要

The kinetics of the evolution of the structure and phase composition of the Fe/SiO2/Si(001) system under different conditions for deposition of the iron layer and subsequent annealing is considered. It is established that the SiO2 thin layer (similar to 1 nm) is not destroyed during iron deposition over a wide temperature range from 20 to 650A degrees C. As a result, iron films with different morphologies are formed on the surface of the oxide. Annealing leads to the destruction of the SiO2 layer at defect sites. This brings about the interaction of iron atoms with the silicon substrate and subsequent formation of iron silicides.
机译:考虑了在不同条件下沉积铁层和随后退火的Fe / SiO2 / Si(001)系统的结构和相组成演变的动力学。可以确定的是,在20至650A的宽温度范围内的铁沉积过程中,不会破坏SiO2薄层(近似于1 nm)。结果,在氧化物表面上形成了具有不同形态的铁膜。退火导致破坏缺陷位置处的SiO2层。这引起铁原子与硅衬底的相互作用并随后形成硅化铁。

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