Modern welding processes for microsystems engineering and electronics taking particular account of the laser

摘要

The microwelding processes used in electronics, electrotechnology and precision mechanics (e.g. microresistance welding, microplasma welding, electronbeam microwelding, thermocompression welding, ultrasonic microwelding and thermosonic microwelding) are described. In comparison with these, laser-beam microwelding is presented with a few examples of its applications. It is shown that, because of its advantages, the laser-beam microwelding process has good prospects in microjoining technology.