Calibration of Rent's rule models for three-dimensional integrated circuits

摘要

In this paper, we determine the accuracy of Rahman's interconnect prediction model for three-dimensional (3-D) integrated circuits. Utilizing this model, we calculate the wiring requirement for a set of benchmark standard-cell circuits. We then obtain placed and routed wirelength figures for these circuits using 3-D standard-cell placement and global-routing tools we have developed. We find that the Rahman model predicts wirelengths accurately (to within 20% of placement and of routing, on average), and suggest some areas for minor improvement to the model.