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首页> 外文期刊>IEEE transactions on very large scale integration (VLSI) systems >Shielding effect of on-chip interconnect inductance
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Shielding effect of on-chip interconnect inductance

机译:片上互连电感的屏蔽效应

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摘要

Interconnect inductance introduces a shielding effect which decreases the effective capacitance seen by the driver of a circuit, reducing the gate delay. A model of the effective capacitance of an RLC load driven by a CMOS inverter is presented. The interconnect inductance decreases the gate delay and increases the time required for the signal to propagate across an interconnect, reducing the overall delay to drive an RLC load. Ignoring the line inductance overestimates the circuit delay, inefficiently oversizing the circuit driver. Considering line inductance in the design process saves gate area, reducing dynamic power dissipation. Average reductions in power of 17% and area of 29% are achieved for example circuits. An accurate model for a CMOS inverter and an RLC load is used to characterize the propagation delay. The accuracy of the delay model is within an average error of less than 9% as compared to SPICE.
机译:互连电感会引入屏蔽效应,从而降低电路驱动器看到的有效电容,从而减少栅极延迟。提出了由CMOS反相器驱动的RLC负载的有效电容模型。互连电感减少了栅极延迟,并增加了信号在互连中传播所需的时间,从而减少了驱动RLC负载的总延迟。忽略线路电感会高估电路延迟,导致电路驱动器尺寸过大。在设计过程中考虑线电感可节省栅极面积,减少动态功耗。例如电路,平均功率降低了17%,面积减少了29%。使用CMOS反相器和RLC负载的准确模型来表征传播延迟。与SPICE相比,延迟模型的准确度在平均误差内小于9%。

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