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Predictive Application of PIDF and PPC for Interconnects' Crosstalk, TSV, and LER Issues in UDSM ICs and Nano-Systems

机译:PIDF和PPC在UDSM IC和纳米系统中互连的串扰,TSV和LER问题的预测应用

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摘要

In this brief, a novel methodology for the prediction of three phenomena related to the interconnects in VLSI circuits will be presented. First, the power (including crosstalk-induced power) prediction for ultradeep submicron ICs and nano systems is proposed. The novelty of the method for crosstalk prediction is deduced by employing a polynomial progressive calibration. Second, as a part of this methodology, we present a new solution for power prediction of through-silicon-vias.
机译:在本简介中,将介绍一种用于预测与VLSI电路中的互连相关的三种现象的新颖方法。首先,提出了超深亚微米IC和纳米系统的功率(包括串扰引起的功率)预测。通过采用多项式渐进式校准,可以推断出串扰预测方法的新颖性。其次,作为该方法的一部分,我们提出了一种用于预测硅通孔功率的新解决方案。

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