Enhancement of solderability of Cu_(60)Zr_(30)Ti_(10) bulk metallic glass by dealloying in hydrofluoric acid solution

摘要

HF treatment and laser soldering was carried out to react with Cu_(60)Zr_(30)Ti_(10) BMG and lead-free solder. The main results were summarized as follows 1. In the reflow process, the HF treated Cu_(60)Zr_(30)Ti_(10) sample showed complete dewetting due to the dissolution of the thin Cu-rich layer into the molten solder. 2. The laser process with 0.01 s irradiation time offered good wettability of SAC and SB solder pastes. At the interface, an IMC layer was observed. The wetting behavior of SB is better than SAC because SB solder paste showed good wetting at broader laser power ranges than SAC paste. The spread area of SB is larger than that of SAC. This is attributed to the lower melting temperature and slower Cu dissolution rate of SB. In this study, the possibility to enhance the solderability of Cu_(60)Zr_(30)Ti_(10) by selective leaching in HF solution and laser soldering was found.