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Hydrogen retention in carbon-tungsten co-deposition layer formed by hydrogen RF plasma

机译:氢射频等离子体形成的碳钨共沉积层中的氢保留

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摘要

Carbon-tungsten co-deposition layers (C-W layers) were formed by sputtering method using hydrogen or deuterium RF plasma. The deposition rate of the C-W layer by deuterium plasma was faster than that by hydrogen plasma, where the increase of deposition rate of tungsten was larger than that of carbon. This indicates that the isotope effect on sputtering-depositing process for tungsten is larger than that for carbon. The release curve of hydrogen from the C-W layer showed two peaks at 400 ℃ and 700 ℃. Comparing the hydrogen release from the carbon deposition layer and the tungsten deposition layer, it is considered that the increase of the release rate at 400 ℃ is affected by tungsten and that at 700 ℃ is affected by carbon. The obtained hydrogen retention in the C-W layers which have over 60 at.% of carbon was in the range between 0.45 and 0.16 as H/(C+W).
机译:使用氢或氘RF等离子体通过溅射法形成碳钨共沉积层(C-W层)。氘等离子体在C-W层上的沉积速率要比氢等离子体快,其中钨的沉积速率比碳的沉积速率要大。这表明钨在溅射沉积过程中的同位素效应大于碳。氢从C-W层的释放曲线在400℃和700℃有两个峰。比较从碳沉积层和钨沉积层释放的氢,可以认为钨在400℃下的释放速率增加,而碳在700℃下的释放速率增加受到影响。在具有60at。%的碳的C-W层中获得的氢保留率以H /(C + W)计为0.45至0.16。

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