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Dry etching of magnesium oxide thin films by using inductively coupled plasma for buffer layer of MFIS structure

机译:MFIS结构缓冲层的电感耦合等离子体干法刻蚀氧化镁薄膜

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摘要

Magnesium oxide thin film has been widely used as a buffer layer and substrate for growing various thin film materials because of very low Gibbs free energy, low dielectric constant and low refractive index. The investigations of the MgO etching characteristics in BCl_3/Ar plasma were carried out using the inductively coupled plasma system. It was found that the increasing BCl_3 in the mixing ratio of BCl_3/Ar plasma causes monotonic MgO etch rate. The results showed in the BCl_3-rich plasma that the etching process is dominantly supplied by the chemical pathway through the ion-assisted chemical reaction.
机译:由于极低的吉布斯自由能,低介电常数和低折射率,氧化镁薄膜已被广泛用作生长各种薄膜材料的缓冲层和基底。使用感应耦合等离子体系统对BCl_3 / Ar等离子体中的MgO蚀刻特性进行了研究。发现在BCl_3 / Ar等离子体的混合比中增加的BCl_3引起单调的MgO蚀刻速率。结果表明,在富含BCl_3的等离子体中,蚀刻过程主要由通过离子辅助化学反应的化学途径提供。

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