机译:衬底偏压对脉冲直流磁控溅射沉积TiAlSiN薄膜微结构演变和力学性能的影响
Univ New South Wales, Sch Mat Sci & Engn, Sydney, NSW 2052, Australia;
Univ New South Wales, Sch Mat Sci & Engn, Sydney, NSW 2052, Australia;
City Univ Hong Kong, Dept Mech & Biomed Engn, Adv Coatings Appl Res Lab, Kowloon, Hong Kong, Peoples R China;
Univ Adelaide, Sch Mech Engn, Adelaide, SA 5005, Australia|Edith Cowan Univ, Sch Engn, Joondalup, WA 6027, Australia;
Titanium aluminum silicon nitride; Pulsed DC bias; Structural evolution; Mechanical properties; Magnetron sputtering;
机译:基板偏压对反应磁控溅射沉积沉积的ZrO2薄膜结构,机械和腐蚀性能的影响
机译:调制结构对高功率脉冲磁控溅射制备的TiAlsin / CrN薄膜微结构和力学性能的影响
机译:衬底溅射刻蚀对射频磁控溅射沉积ZnO薄膜的微观结构和光学性能的影响
机译:甲烷流量对活性直流磁控溅射沉积碳化硅薄膜微观结构和力学性能的影响
机译:用于微辐射热计应用的脉冲直流磁控溅射氧化钒薄膜的制备,表征和沉积后修饰
机译:在不加热衬底的情况下通过射频磁控等离子体溅射沉积的铝掺杂氧化锌薄膜的空间分辨光电性能
机译:衬底偏压对射频磁控溅射沉积Ti6A14V薄膜晶体结构和表面成分的影响