Carbon Nanostructures Dedicated to Millimeter-Wave to THz Interconnects

摘要

This paper focuses on the use of CNTs for new mm-to-THz interconnects for nanopackaging. To successfully integrate CNT to be in line with nanoelectronics trends, new growth processes and modeling approaches are proposed. Several experimental works are presented such as millimeter-wave flip-chip bonding. In addition, novel THz 3-D wireless interconnect, based on CNT monopole antennas, working at 200 and 300 GHz are designed, simulated, and fabricated.