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A 474 GHz HBV Frequency Quintupler Integrated on a 20 src='/images/tex/1025.gif' alt='mu{hbox {m}}'> Thick Silicon Substrate

机译:集成在20个 src =“ / images / tex / 1025.gif” alt =“ mu {hbox {m}}”> 厚硅片上的474 GHz HBV频率五联器基质

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摘要

We present a silicon integrated Heterostructure Barrier Varactor (HBV) frequency quintupler (5) operating between 440 GHz and 490 GHz. By epitaxial transfer of InP-based HBV material structure onto silicon-on-insulator (SOI), a uniform and accurate thickness (20 ) of the frequency quintupler chip is achieved. In a single stage this device delivers 2.8 mW of output power at 474 GHz, when pumped with 400 mW at 94.75 GHz, corresponding to conversion efficiency of 0.75%. The present device exhibits a 3-dB bandwidth of 4%.
机译:我们介绍了工作在440 GHz和490 GHz之间的硅集成异质结构势垒变容二极管(HBV)频率五重频率转换器(5)。通过将基于InP的HBV材料结构外延转移到绝缘体上硅(SOI)上,可实现频率五倍频器芯片的均匀且精确的厚度(20)。在94.75 GHz下以400 mW泵浦时,该器件在474 GHz下可在2.8 GHz内输出2.8 mW的输出功率,转换效率为0.75%。本设备具有3%的4%带宽。

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