Step 2: Process Control

摘要

The development of a controlled and robust reflow process exerts a significant effect on joint formation, and ultimately, board quality. A robust and reliable soldering process can be achieved only by a calculated and well-executed strategy of studying the effect of critical process parameters on defect formation and yield, as well as an understanding of the interrelation between components, paste, flux, and board material. The technology forecast continues to provide consistent data on the nature of the soldering landscape in electronics assembly.