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DC conduction properties of Gadolinium-Indium oxide films deposited on Si(100)

机译:沉积在Si(100)上的Ga-氧化铟膜的直流导电特性

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Thin (Gd-In) oxide films were prepared by alternating deposition method on Si (P) substrates to form MOS structures in order to investigate their dc-electrical properties. These films were annealed at different conditions and characterised by X-ray fluorescence (XRF) and X-ray diffraction (XRD). The capacitance-gate voltage (C-V_g) dependence was used to study the effect of annealing conditions on the effective relative permittivity, concentration of the charges in the film, and determination the accumulation voltage region. The dc-current transfer in the samples is studied as a function of gate voltage at accumulation polarity and temperature in the range (293-390 K). The measurements showed ohmic conduction at low voltages. But, at voltages V > 0.4 V, the current transfer followed the trap-charge-limited space-charge-limited conductivity (TCLC-SCLC) mechanism characterised by exponential distribution of traps within the band gap. The total traps concentrations are 4.1 x 10~(24) m~(-3) and 2.2 x 10~(24) m~(-3) for samples annealed in oxygen atmosphere and in vacuum, respectively.
机译:通过交替沉积方法在Si(P)衬底上制备薄的(Gd-In)氧化膜,以形成MOS结构,以研究其dc电性能。这些膜在不同条件下退火,并通过X射线荧光(XRF)和X射线衍射(XRD)进行表征。电容-栅极电压(C-V_g)依赖性用于研究退火条件对有效相对介电常数,薄膜中电荷浓度以及确定累积电压区域的影响。研究了样品中的直流电流在累积极性和温度范围(293-390 K)下与栅极电压的关系。测量显示低电压下的欧姆传导。但是,在电压V> 0.4 V时,电流传输遵循陷阱带电限制空间电荷限制电导率(TCLC-SCLC)机制,其特征是带隙内的陷阱呈指数分布。对于在氧气气氛和真空中退火的样品,总阱的浓度分别为4.1 x 10〜(24)m〜(-3)和2.2 x 10〜(24)m〜(-3)。

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