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Gate line edge roughness amplitude and frequency variation effects on intra die MOS device characteristics

机译:栅极线边缘粗糙度幅度和频率变化对管芯内MOS器件特性的影响

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Random fluctuations in fabrication process outcomes such as gate line edge roughness (LER) give rise to corresponding fluctuations in scaled down MOS device characteristics. A thermodynamic-variational model is presented to study the effects of LER on threshold voltage and capacitance of sub-50 nm MOS devices. Conceptually, we treat the geometric definition of the MOS devices on a die as consisting of a collection of gates. In turn, each of these gates has an area, A, and a perimeter, P, defined by nominally straight lines subject to random process outcomes producing roughness. We treat roughness as being deviations from straightness consisting of both transverse amplitude and longitudinal wavelength each having lognormal distribution. We obtain closed-form expressions for variance of threshold voltage (V_(th)), and device capacitance (C) at Onset of Strong Inversion (OSI) for a small device. Using our variational model, we characterized the device electrical properties such as σ_(V_(th)) and σ_C in terms of the statistical parameters of the roughness amplitude and spatial frequency, i.e., inverse roughness wavelength. We then verified our model with numerical analysis of V_(th) roll-off for small devices and σ_(V_(th))due to dopant fluctuation. Our model was also benchmarked against TCAD of σ_(V_(th)) as a function of LER. We then extended our analysis to predict variations in σ_(V_(th)) and σ_C versus average LER spatial frequency and amplitude, and oxide-thickness. Given the intuitive expectation that LER of very short wavelengths must also have small amplitude, we have investigated the case in which the amplitude mean is inversely related to the frequency mean. We compare with the situation in which amplitude and frequency mean are unrelated. Given also that the gate perimeter may consist of different LER signature for each side, we have extended our analysis to the case when the LER statistical difference between gate sides is moderate, as well as when it is significantly large.
机译:制造工艺结果中的随机波动(例如栅极线边缘粗糙度(LER))会导致按比例缩小的MOS器件特性产生相应的波动。提出了一个热力学变化模型来研究LER对50nm以下MOS器件阈值电压和电容的影响。从概念上讲,我们将管芯上MOS器件的几何定义视为由一组门组成。依次地,这些浇口中的每一个都具有面积A和周长P,由标称直线定义,该直线受制于粗糙度的随机过程结果的影响。我们将粗糙度视为是由均具有对数正态分布的横向振幅和纵向波长组成的直线度偏差。我们获得了针对小型设备的阈值电压(V_(th))和在强反转开始(OSI)时的设备电容(C)的方差的封闭形式。使用我们的变分模型,我们根据粗糙度幅度和空间频率的统计参数(即逆粗糙度波长)表征了器件的电性能,例如σ_(V_(th))和σ_C。然后,我们通过对小型器件的V_(th)滚降和σ_(V_(th))的数值分析(由于掺杂剂波动)验证了我们的模型。我们的模型还根据LER_的σ_(V_(th))的TCAD进行了基准测试。然后,我们扩展了分析以预测σ_(V_(th))和σ_C与平均LER空间频率和幅度以及氧化物厚度的关系。鉴于直观的期望,即非常短波长的LER也必须具有较小的幅度,因此我们研究了幅度平均值与频率平均值成反比的情况。我们将振幅和频率均值无关的情况进行比较。还要考虑到门的周长可能由每一侧的不同LER签名组成,因此我们将分析扩展到了门两侧之间的LER统计差异适中以及明显大的情况。

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