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首页> 外文期刊>IEEE Journal of Solid-State Circuits >Near speed-of-light signaling over on-chip electrical interconnects
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Near speed-of-light signaling over on-chip electrical interconnects

机译:片上电互连上的近光速信令

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摘要

The propagation limits of electrical signals for systems built with conventional silicon processing are explored. A design which takes advantage of the inductance-dominated high-frequency regime of on-chip interconnect is shown capable of transmitting data at velocities near the speed of light. In a 0.18-/spl mu/m six-level aluminum CMOS technology, an overall delay of 283 ps for a 20-mm-long line, corresponding to a propagation velocity of one half the speed of light in silicon dioxide, has been demonstrated. This approach offers a five times improvement in delay over a conventional repeater-insertion strategy.
机译:探索了用常规硅处理构建的系统的电信号的传播极限。示出了一种利用片上互连的电感为主的高频方式的设计,该设计能够以接近光速的速度传输数据。在0.18- / splμu/ m的六级铝CMOS技术中,已证明20毫米长的线的总延迟为283 ps,对应于二氧化硅中光速的一半的传播速度。 。与传统的中继器插入策略相比,此方法的延迟提高了五倍。

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