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A 40-Gb/s Transimpedance Amplifier in 0.18-$mu$m CMOS Technology

机译:采用0.18-μmCMOS技术的40 Gb / s跨阻放大器

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摘要

A 40-Gb/s transimpedance amplifier (TIA) is realized in 0.18-$mu{hbox {m}}$ CMOS technology. From the measured S-parameters, a transimpedance gain of 51 ${hbox {dB}}Omega$ and a 3-dB bandwidth up to 30.5 GHz were observed. A bandwidth enhancement technique, $pi$-type inductor peaking (PIP), is proposed to achieve a bandwidth enhancement ratio (BWER) of 3.31. In addition, the PIP topology used at the input stage decreases the noise current as the operation frequency increases. Under a 1.8 V supply voltage, the TIA consumes 60.1 mW with a chip area of $hbox{1.17}times hbox{0.46} {hbox {mm}}^{2}$. The proposed CMOS TIA presents a gain–bandwidth product per DC power figure of merit $({rm GBP}/P_{rm dc})$ of 180.1 ${hbox{GHz}}Omega/{hbox{mW}}$.
机译:40 Gb / s跨阻放大器(TIA)采用0.18-μMCMOS技术实现。根据测得的S参数,可以观察到51 $ {hbox {dB}}Ω的跨阻增益和高达30.5 GHz的3-dB带宽。提出了一种带宽增强技术,即π型电感器峰值(PIP),以实现3.31的带宽增强比(BWER)。此外,随着工作频率的增加,在输入级使用的PIP拓扑会降低噪声电流。在1.8 V电源电压下,TIA的功耗为60.1 mW,芯片面积为$ hbox {1.17}乘以hbox {0.46} {hbox {mm}} ^ {2} $。拟议的CMOS TIA表示每直流功率品质因数$({rm GBP} / P_ {rm dc})$的增益带宽积为$ 180.1 $ {hbox {GHz}} Omega / {hbox {mW}} $。

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