Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology

摘要

We present highly integrated 60-GHz radar transceivers for industrial sensor applications. The bistatic and monostatic transceivers are implemented in the SiGe bipolar technology and packaged using the embedded wafer-level ball grid array technology that allows for direct embedding of the antennas in the package redistribution layer. In this way, very compact and efficient radar frontends comprising all millimeter-wave components can be implemented in an mm2 package. These frontends were soldered on a standard low-cost printed circuit board based on FR4 material. For verification of the proposed frontends, an frequency-modulated continuous wave (FMCW) radar system was developed and set up within this paper. Theoretical considerations and simulations as well as corresponding measurements were carried out for the evaluation of the designed system. The demonstrator results of these embedded radar sensors show an excellent system performance at a high integration level.