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One-step bonding and hydrophobic surface modification method for rapid fabrication of polycarbonate-based droplet microfluidic chips

机译:一种快速制备聚碳酸酯微滴微流控芯片的一步结合疏水表面改性方法

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摘要

Chip bonding and hydrophobic surface modification are two critical processes for the fabrication of a droplet microfluidic chip from the thermoplastic polycarbonate (PC) material. In this paper, we describe a novel one-step method, which simultaneously bonded and modified two PC substrates. The mechanism of this one-step method is that n-pentane acts as a sacrificial solvent and acetone is the solvent that bonds the PC substrates. Additionally, entrapment functionalization and the Si-O-Si cross-linked network play a central role in the hydrophobic surface modification process. The method was optimized to achieve a high bonding strength, low surface roughness, and high optical transmittance. The naturally hydrophilic PC substrate surface was modified to become a hydrophobic surface, with surface tension decreased from 33.6 mN/m to 14.8 mN/m. Monodisperse droplets generated using a droplet generation chip fabricated by this method had an average diameter of 101.3 mu m and coefficient of variation of 0.55%. A droplet digital polymerase chain reaction experiment was successfully carried out using droplets generated from this chip, which demonstrated the effectiveness of this method. This novel one-step method holds great potential for manufacturing droplet-based microfluidic chips using PC in large-scale, and it may have broad applications in microfluidic research fields.
机译:芯片键合和疏水性表面改性是从热塑性聚碳酸酯(PC)材料制造液滴微流控芯片的两个关键过程。在本文中,我们描述了一种新颖的单步方法,该方法可以同时粘合和修饰两个PC基板。这种单步方法的机理是正戊烷用作牺牲溶剂,而丙酮则是粘结PC基板的溶剂。另外,包封官能化和Si-O-Si交联网络在疏水表面改性过程中起着核心作用。对方法进行了优化,以实现高粘结强度,低表面粗糙度和高透光率。将天然亲水性PC基材表面改性为疏水性表面,其表面张力从33.6 mN / m降至14.8 mN / m。使用通过该方法制造的液滴产生芯片产生的单分散液滴的平均直径为101.3μm,变异系数为0.55%。使用该芯片产生的液滴成功进行了液滴数字聚合酶链反应实验,证明了该方法的有效性。这种新颖的一步法在利用PC大规模制造基于液滴的微流控芯片方面具有巨大潜力,并且可能在微流控研究领域具有广泛的应用。

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