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General characteristics of crack arrays in epilayers grown under tensile strain

机译:在拉伸应变下生长的外延层中裂纹阵列的一般特征

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摘要

A simple model is presented to describe the formation of cracks, the expected population density and their depth in tensile strained epilayers. It is shown that the critical thickness for crack formation is expected to be constant across a broad range of simple materials. The crack depth, crack spacing and critical thickness predicted by the model are shown to agree well with experimental observations on III-V compound semiconductors. Inefficiencies in the crack generation process are discussed in terms of crack vibration.
机译:提出了一个简单的模型来描述裂纹的形成,预期的人口密度及其在拉伸应变外延层中的深度。结果表明,在广泛的简单材料中,裂纹形成的临界厚度是恒定的。该模型预测的裂纹深度,裂纹间距和临界厚度与III-V族化合物半导体的实验观察结果非常吻合。就裂纹振动而言,讨论了裂纹产生过程的效率低下。

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