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Fabrication of SiGe-on-insulator substrates by a condensation technique: an experimental and modelling study

机译:凝结技术在绝缘体上SiGe衬底的制造:实验和模型研究

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Today, to our knowledge, only two techniques are used to perform GeOI substrates: the Smart-Cut™ technique and the Ge condensation technique. The latter is very sensitive to the initial parameters but is the only one which allows Si and Ge-on-insulator co-integration. Predictions of experimental results are then necessary to associate the best processes with the defined starting structures. This paper presents for the first time studies on Ge condensation technique simulations. Enrichment kinetics occurring in the classical one-dimensional condensation process have been simulated by the TCAD Silvaco Athena tool and analytical calculations. The good correlation with experimental data permits us to confirm the process dependence to the initial parameters. The influence of the process-induced non-homogeneities for the prestructure fabrication is also highlighted by the simulation results. The analytical model is efficient to predict a lot of experimental data with short calculation times. For more complex processes involving a two- or three-dimensional oxidation, enrichment prediction accuracy obtained by the analytic model is limited. Mechanism predictions under these experimental conditions are necessary to be studied by TCAD simulations.
机译:今天,据我们所知,仅使用两种技术来制造GeOI基板:Smart-Cut™技术和Ge冷凝技术。后者对初始参数非常敏感,但是它是唯一允许Si和Ge-on-insulator共集成的参数。为了使最佳工艺与定义的起始结构相关联,必须对实验结果进行预测。本文首次介绍了Ge凝聚技术模拟的研究。 TCAD Silvaco Athena工具和解析计算已模拟了经典一维冷凝过程中发生的富集动力学。与实验数据的良好相关性使我们能够确定过程对初始参数的依赖性。仿真结果也突出了过程引起的不均匀性对预制件制造的影响。分析模型可以有效地以较短的计算时间预测大量实验数据。对于涉及二维或三维氧化的更复杂的过程,通过分析模型获得的富集预测精度受到限制。在这些实验条件下的机理预测是必须通过TCAD模拟研究的。

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