首页> 外文期刊>Semiconductor science and technology >Nitride-based metal-insulator- semiconductor capacitors with liquid-phase deposition oxide and (NH_4)_3S_x pretreatment prepared on sapphire substrates
【24h】

Nitride-based metal-insulator- semiconductor capacitors with liquid-phase deposition oxide and (NH_4)_3S_x pretreatment prepared on sapphire substrates

机译:在蓝宝石衬底上进行了具有液相沉积氧化物和(NH_4)_3S_x预处理的基于氮化物的金属绝缘体半导体电容器

获取原文
获取原文并翻译 | 示例
       

摘要

Nitride-based metal-insulator-semiconductor (MIS) capacitors with liquid-phase deposition (LPD) oxide and (NH_4)_2S_x pretreatment were successfully prepared on sapphire substrates. It was found that we can significantly reduce the leakage current densities of the fabricated Al/LPD-SiO_2/AlGaN MIS capacitors by using (NH_4)_2S_x treatment. Compared to the MIS capacitors without (NH_4)_2S_x treatment, the leakage current densities were remarkably reduced by two orders of magnitude in (NH_4)_2S_x-treated MIS capacitors. Capacitance-voltage measurement showed that the MIS capacitor without (NH_4)_2S_x treatment was rather leaky. In contrast, the flat-band voltage shift, fixed oxide charge density and interface trap density of the fabricated MIS capacitor with (NH_4)_2S_x treatment were much improved to be 2.01 V, 7.22 × 10~(11) cm~(-2) and 7.19 × 10~(11) cm~2 eV~(-1), respectively. A related mechanism of (NH_4)_2S_x treatment was discussed by an x-ray photoelectron spectrometer
机译:在蓝宝石衬底上成功制备了具有液相沉积(LPD)氧化物和(NH_4)_2S_x预处理的基于氮化物的金属绝缘体(MIS)电容器。发现通过使用(NH_4)_2S_x处理,可以显着降低所制造的Al / LPD-SiO_2 / AlGaN MIS电容器的漏电流密度。与未经(NH_4)_2S_x处理的MIS电容器相比,经(NH_4)_2S_x处理的MIS电容器的漏电流密度显着降低了两个数量级。电容电压测量结果表明,未经(NH_4)_2S_x处理的MIS电容器很漏电。相比之下,经(NH_4)_2S_x处理的MIS电容器的平带电压漂移,固定氧化物电荷密度和界面陷阱密度得到了极大改善,分别为2.01 V,7.22×10〜(11)cm〜(-2)。和7.19×10〜(11)cm〜2 eV〜(-1)。用X射线光电子能谱仪讨论了(NH_4)_2S_x处理的相关机理

著录项

  • 来源
    《Semiconductor science and technology》 |2009年第7期|163-167|共5页
  • 作者单位

    Institute of Microelectronics and Department of Electrical Engineering, Center for Micro/Nano Science and Technology, Advanced Optoelectronic Technology Center, National Cheng Rung University, Tainan 701, Taiwan;

    Department of Applied Physics, National ChiaYi University, ChiaYi 600, Taiwan;

    Institute of Microelectronics and Department of Electrical Engineering, Center for Micro/Nano Science and Technology, Advanced Optoelectronic Technology Center, National Cheng Rung University, Tainan 701, Taiwan;

    Department of Electrical Engineering, Da-Yeh University, Da-Tsuen, Changhua, Taiwan;

    Materials and Electro-Optics Research Division, Chung Shan Institute of Science and Technology, Taoyuan 325, Taiwan;

    Materials and Electro-Optics Research Division, Chung Shan Institute of Science and Technology, Taoyuan 325, Taiwan;

    Materials and Electro-Optics Research Division, Chung Shan Institute of Science and Technology, Taoyuan 325, Taiwan;

    Materials and Electro-Optics Research Division, Chung Shan Institute of Science and Technology, Taoyuan 325, Taiwan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号