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Approaches to designing thermally stable Schottky contacts to n-GaN

机译:设计与n-GaN热稳定的肖特基接触的方法

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The barrier heights of PdIn, Ni/Ga/Ni and Re Schottky contacts to n-GaN were investigated by current-voltage and capacitance-voltage measurements. Elemental Pd and Ni contacts were also investigated for comparison. In each case, the barrier heights were determined as a function of annealing temperature. It was shown that stoichiometric PdIn contacts were more stable than Pd-only contacts. Similarly, Ni/Ga/Ni diodes were found to be more stable than Ni diodes. Both the Ni/Ga/Ni contact and the elemental Re contact were stable on short-term annealing up to 700 ℃.
机译:通过电流-电压和电容-电压测量研究了PdIn,Ni / Ga / Ni和Re Schottky接触对n-GaN的势垒高度。还对元素Pd和Ni接触进行了比较研究。在每种情况下,将势垒高度确定为退火温度的函数。结果表明,化学计量的PdIn触点比纯Pd触点更稳定。类似地,发现Ni / Ga / Ni二极管比Ni二极管更稳定。 Ni / Ga / Ni接触和元素Re接触在最高700℃的短期退火下均稳定。

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