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Normally-off AlGaN/GaN high electron mobility transistors on Si substrate with selective barrier regrowth in ohmic regions

机译:常压AlGaN / GaN高电子迁移率在Si衬底上,具有选择性屏障再生在欧姆地区

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摘要

In this paper, we report the fabrication of a normally-off AlGaN/GaN high electron mobility transistor (HEMT) using an ultra-thin AlGaN barrier layer structure on Si (111) substrate. Additional AlGaN layers were selectively regrown only on the ohmic contact areas. The fabricated device exhibits a positive threshold voltage of 0.3 V, a maximum drain output current of 753 mA mm(-1) at gate voltage of +4 V, and low gate leakage of 1.2 x 10(-7) A mm(-1). The selective area growth method shows a promising way to achieve normally-off GaN based HEMTs with very good performance.
机译:在本文中,我们在Si(111)衬底上使用超薄AlGaN阻挡层结构报告常关的AlGaN / GaN高电子迁移率晶体管(HEMT)的制造。 额外的AlGaN层仅在欧姆接触区域上选择性地再生。 制造的装置表现出0.3V的正阈值电压,最大限度的漏极输出电流为753 mm mm(-1),栅极电压为+4v,低栅极泄漏为1.2×10(-7)mm(-1 )。 选择性地区生长方法显示了具有非常好的性能的常关GaN的常关GaN的有希望的方法。

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