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Integration of multi-layered materials with wide bandgap semiconductors for multi-spectral photodetectors: case for MoS_2/GaN and β-ln_2Se_3/GaN

机译:用于多光谱光电探测器的多层材料与宽带隙半导体的集成:MoS_2 / GaN和β-In_2Se_3/ GaN的情况

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We report on the demonstration of UV/visible and UVear-IR photodetectors of high spectral responsivity (SR) in a non-conventional heterojunction, realized by combining multi-layered materials with wide band gap Gallium Nitride (GaN). Multi-layer MoS2 and beta-In2Se3 flakes were exfoliated separately on epitaxial GaN-on-sapphire, followed by fabrication of photodetectors in a lateral inter-digitated metal semiconductor metal geometry with Ti/Au contacts. Devices exhibited distinct steps in SR graph at 365 nm with responsivity value of 127 AW(-1) and at similar to 685 nm with responsivity value of 33 AW(-1) for MoS2/GaN heterostructure. Whereas, similar steps exhibited at 365 nm with responsivity value of 1.6 AW(-1) and at similar to 850 nm with responsivity value of 0.03 AW-1 in case of beta-In2Se3/GaN heterostructure. The wavelength dependent I-V characteristics showed photo-to-dark current ratio of similar to 30 at 685 nm in case of MoS2/GaN heterostructure and ratio of similar to 2 at 850 nm for beta-In2Se3/GaN heterostructure. The reasons which limit the performance of the devices were also investigated using transient analysis and power dependent responsivity analysis. In summary, current work paves the way for futuristic layered-materials/3D heterostructure devices.
机译:我们报告了在非常规异质结中通过将多层材料与宽带隙氮化镓(GaN)相结合实现的高光谱响应(SR)的UV /可见光和UV /近红外光电探测器的演示。在蓝宝石外延蓝宝石上分别剥落多层MoS2和β-In2Se3薄片,然后以具有Ti / Au触点的横向叉指金属半导体金属几何形状制造光电探测器。器件在SR图中在365 nm处的响应阶跃值为127 AW(-1),对于MoS2 / GaN异质结构在685 nm下的响应阶跃值为33 AW(-1)。而在β-In2Se3/ GaN异质结构的情况下,相似的步骤在365 nm处具有1.6 AW(-1)的响应度,在850 nm处具有0.03 AW-1的响应度。在MoS2 / GaN异质结构的情况下,波长相关的I-V特性显示在685 nm处光暗电流比接近30,对于β-In2Se3/ GaN异质结构在850 nm处光暗电流比接近2。还使用瞬态分析和功率相关的响应度分析来研究限制设备性能的原因。总而言之,当前的工作为未来的分层材料/ 3D异质结构设备铺平了道路。

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