Detecting Non-Visual Defects is Vital for 0.18 μm

摘要

Though much progress has been made to increase yields using visual defect data, the use of non-visual defect data is less common. Many non-visual defects are not detected until final electrical test, which means many wafers can be mispro- cessed before corrective action is taken. Measuring enough parametric data to control yields from structures that consume little wafer surface area is possible, but it requires innovative methods.