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LOW DEFECT DENSITY PROCESS FOR DEEP SUB-0.18MUM FLASH MEMORY TECHNOLOGIES
LOW DEFECT DENSITY PROCESS FOR DEEP SUB-0.18MUM FLASH MEMORY TECHNOLOGIES
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机译:低于0.18 MUM的深层闪存技术的低缺陷密度过程
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摘要
A method of forming flash memory EEPROM devices having a low energy source implant and a high-energy VSS connection implant such that the intrinsic source defect density is reduced and the VSs resistance is low. The source regions are implanted with a low energy, low dosage dopant ions and the VSS regions are implanted with a high energy, high dosage dopant ions.
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机译:一种形成具有低能量源注入和高能量V SS Sub>连接注入的闪存EEPROM器件的方法,以降低固有源缺陷密度并降低V Ss Sub>电阻低。源区注入低能,低剂量的掺杂剂离子,而V SS Sub>区注入高能,高剂量的掺杂剂离子。
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