首页> 外文期刊>Semiconductor International >Mist Deposition in Semiconductor Device Manufacturing
【24h】

Mist Deposition in Semiconductor Device Manufacturing

机译:半导体器件制造中的薄雾沉积

获取原文
获取原文并翻译 | 示例
       

摘要

The results discussed in this paper demonstrate the feasibility of mist deposition in the formation of very thin films in advanced nanoelectronic and photonic manufacturing using liquid precursors. In both cases of photoresist and high-k dielectric processing, deposition is well controlled and produces uniform, mechanically coherent films, even in the ultrathin thickness regime. The method is independent of the shape of the substrate, and hence, in the case of photoresist, can be used not only in standard wafer processing, but also in large display as well as large reticle manufacturing. Overall, mist deposition has the potential to supplement spin-on process in those applications in which effectiveness of the latter will be limited. By doing so, mist deposition may extend the use of liquid precursors in high-end IC, as well as LCD, manufacturing by supplementing spin-on processes in selected applications.
机译:本文讨论的结果证明了在使用液体前体的先进纳米电子和光子制造中,雾沉积在形成非常薄的薄膜中的可行性。在光致抗蚀剂和高k介电工艺的情况下,即使在极薄的厚度范围内,沉积也得到很好的控制,并能产生均匀的,机械上连贯的薄膜。该方法与衬底的形状无关,因此,在光致抗蚀剂的情况下,该方法不仅可以用于标准晶片处理中,而且可以用于大型显示​​器以及大型掩模版的制造中。总的来说,在那些将限制旋喷工艺效率的应用中,雾气沉积有可能补充旋喷工艺。这样,通过补充选定应用中的旋涂工艺,雾气沉积可以扩展液体前驱物在高端IC和LCD制造中的使用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号