在常规的等离子体刻蚀基础上,介绍了一种基于循环方式的逐层刻蚀方法及进一步改善的方案,可以有效解决常规等离子体刻蚀的深宽比相关效应,提高刻蚀选择比,降低刻蚀粗糙度和损伤.%This paper introduced a cyclic layer-by-layer etching process based on plasma etching technology. Layer-by-layer etching technology could solve several conventional plasma etching problems, such as aspect ratio dependent etching effect. Furthermore, layer-by-layer etching process could achieve relatively high etching selectivity and low etching roughness and etching damage.
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