机译:1-己烯和丙烯沉积的非晶碳层在半导体器件制造中干法刻蚀硬掩模的性能比较研究
Department of Materials Science & Engineering, Korea University, Seoul 136-701, Republic of Korea, TC Technology Team, Samsung Electronics Co. Ltd., Gyeounggi-Do 446-711, Republic of Korea;
TC Technology Team, Samsung Electronics Co. Ltd., Gyeounggi-Do 446-711, Republic of Korea;
TC Technology Team, Samsung Electronics Co. Ltd., Gyeounggi-Do 446-711, Republic of Korea;
Department of Materials Science & Engineering, Korea University, Seoul 136-701, Republic of Korea;
TC Technology Team, Samsung Electronics Co. Ltd., Gyeounggi-Do 446-711, Republic of Korea;
TC Technology Team, Samsung Electronics Co. Ltd., Gyeounggi-Do 446-711, Republic of Korea;
Department of Materials Science & Engineering, Korea University, Seoul 136-701, Republic of Korea;
ACL; PECVD; C_6H_12; Dry etch; Hard mask; Semiconductor;
机译:由(C_6H_12)/ Ar / He化学沉积的非晶碳膜的制备和分析,用作半导体制造工艺中的干法蚀刻硬掩模
机译:沉积温度和热退火对半导体器件干法刻蚀工艺中a-C:H膜干法刻蚀速率的影响
机译:使用由丙烯沉积的相对透明的无定形碳硬掩模进行高深宽比接触孔蚀刻
机译:具有与非晶碳层(ACL)相当的耐蚀性的旋涂碳硬掩模的开发
机译:卤化物钙钛矿半导体结构和电化学的研究与光电器件,能量存储和CO2捕获中的应用中的共价官能化碳
机译:基于聚乙烯醇(PVA)的增塑无定形生物聚合物混合电解质的研究:壳聚糖具有高离子传导性的储能双层电容(EDLC)装置应用
机译:热稳定性和长期氢/氘释放从软到 使用原位拉曼光谱分析硬质无定形碳层。 与Tore supra矿床的比较
机译:真空电弧沉积非晶态硬碳薄膜的性能