Pipe' Provides Express Lane for High-Speed Chip-to-Chip Signals

摘要

For an increasing number of applications, connection speed between die is an important factor in the decision between system-on-a-chip (SoG) and system-in-package (SiP) implementation. Silicon Pipe's (San Jose) off-the-top (OTT) packaging technology enables gigabit per second chip-to-chip communication, which can shift some of these decisions in favor of SiP and enable new SiP possibilities.