Electroless CoWP Boosts Copper Reliability, Device Performance

摘要

Development of electroless CoWP technology for 65 and 45 nm deployment is underway at the leading IC companies. Alkali metal-free semiconductor-grade chemicals, and high-throughput production tools for deposition and metrology are now available. CoWP will allow the semiconductor industry to overcome interconnect reliability obstacles and provide performance improvements by alleviating the use of materials that increase k_(eff) of the ILD.