For years, people have been making contacts that go through the die, though the number of applications has been limited. In recent years, through-silicon contacts have been examined for use in MEMS packaging and for three-dimensional integration of ICs. Researchers at the Association of Super-Advanced Technologies (ASET, Tokyo) have developed a through-silicon contact technology that has found its way into a commercial camera-phone product. They presented their results at the latest IMAPS. Previous applications for through-silicon contact technology include RF applications. Several years ago, through-silicon contact technology was used to allow RF die to be attached face-up in cases where it would be advantageous. For an increasing number of MEMS applications, it is either less expensive, more reliable, or both, to make the MEMS devices and their electronics on separate wafers, then bond them later. In many cases, the best choice is to make through-contacts next to the micro-machined device.
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