Solutions to Five Yield, Reliability Problems

摘要

J.B. Tan of Chartered Semiconductor Manufacturing Ltd. (Singapore) will soon present solutions to five yield and reliability challenges associated with multilevel interconnect builds and the integration of copper and low-k dielectrics. Engineers identified these challenges prior to-the transfer of the interconnect process to mass production, and will present the results at the upcoming International Interconnect Technology Conference June 5-7 in Burlingame, Calif.