3-D Gets Past 'Chicken or Egg' Problem

摘要

When IMEC (Leuven, Belgium) announced its expanded programs in 3-D at its annual meeting last year, Eric Beyne, scientific director of packaging, interconnect and systems integration, admitted that "3-D design suffers from a 'chicken or egg' problem." Users that are evaluating the cost trade-offs of 3-D integration need design tools to evaluate the benefits of manufacturing in 3-D (z direction) vs. 2-D.