NanoFoil~® Solders with Less Heat

摘要

Heat is becoming one of the most critical issues in computer and semiconductor design," says Intel Corporation's Chief Technology Officer, Pat Gelsinger. As microprocessors in computers operate faster, they produce more heat. However, the difficulty of conducting this increased heat out of a chip is limiting both chip performance and reliability. The most effective way to get heat intc the heat sink would be to attach the chip package with a conductive metallic bond such as a solder. But soldering the components in a hot furnace can damage or destroy the chip. Epoxies do not damage the chip, but they tend to degrade over time, and their bond is weaker and conducts substantially less heat than a metallic soldered joint.