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Direct Matrix Solution of Linear Complexity for Surface Integral-Equation-Based Impedance Extraction of Complicated 3-D Structures

机译:基于表面积分方程的复杂3D结构阻抗提取的线性复杂度直接矩阵解

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摘要

We develop a linear-complexity direct matrix solution for the surface integral equation (IE)-based impedance extraction of arbitrarily shaped 3-D nonideal conductors embedded in a dielectric material. A direct inverse of a highly irregular system matrix composed of both dense and sparse matrix blocks is obtained in $O(N)$ complexity with $N$ being the matrix size. It outperforms state-of-the-art impedance solvers, be they direct solvers or iterative solvers, with fast central processing unit (CPU) time, modest memory consumption, and without sacrificing accuracy, for both small and large number of unknowns. The inverse of a 2.68-million-unknown matrix arising from the extraction of a large-scale 3-D interconnect having 128 buses, which is a matrix solution for 2.68 million right-hand sides, was obtained in less than 1.5 GB memory and 1.3 h on a single CPU running at 3 GHz.
机译:我们针对嵌入在介电材料中的任意形状的3D非理想导体的基于表面积分方程(IE)的阻抗提取开发了线性复杂度直接矩阵解决方案。在 $ O(N)$ 中可以获得由密集和稀疏矩阵块组成的高度不规则系统矩阵的直接逆。复杂度,其中 $ N $ 为矩阵大小。无论是直接求解器还是迭代求解器,它对于小型和大型未知数都具有快速的中央处理器(CPU)时间,适度的内存消耗且不牺牲精度的性能,优于直接阻抗求解器或迭代求解器。在不到1.5 GB的内存和1.3的内存中,提取了具有128条总线的大规模3-D互连所产生的268万未知矩阵的逆,该矩阵是268万右侧的矩阵解决方案。 h在运行于3 GHz的单个CPU上运行。

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