Achieving Fine Lines Using UV Laser Photolithography

摘要

High-density substrates have been a key driver enabling the manufacture of a host of electronics appliances, including laptop computers, cell phones, and pagers, among others. A common method used to increase the density of conventional FR-4 boards used in electronics appliances involves the use of build-up layers consisting of high-performance unfilled and metallized dielectrics. Materials used in this method of manufacture include certain types of resin-coated foil (RCF)~* and "resin-coated copper" ("RCC")~(**), both of which use B-and C-stage epoxy as the dielectric, or polyimide with epoxy adhesive as the dielectric base~(***).