Tricks of High-Speed PCB Stack-Up

摘要

Success in electronic hardware development requires skill in managing many tradeoffs. I believe the most effective methods for high-speed PCB stack-up design involve the true collaborative efforts of engineering, design, manufacturing, test and business resources. I have discovered several high-speed stack-up design tips. 1. Avoid adjacent signal routing layers The opportunity for undesired signal coupling and impedance discontinuities is great when circuit conductors are positioned on directly adjacent metal layers within a substrate. Furthermore, at the routing density required by high pin-count VLSI packages, the condition of having two conductors directly shadowing each other on adjacent layers must often be achieved in order to reach 100% connectivity, thus degrading electrical performance.