Selecting a Sound PCB Stack-up Strategy: Cost Adders

摘要

AFTER COMPONENTS ARE placed and test strategy defined, if you find yourself worried there isn't enough room left over to route traces and create power paths, there is no need to panic. This is a common condition caused by today's dense packaging. The design requirements have transitioned into a need for multilayer PCB design technology. It is time for vertical thinking, where important z-axis strategy for routing and power planes is considered.