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Milestones in HORIZONTAL PLATING

机译:水平电镀的里程碑

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摘要

The origins of horizontal plating are "low profile," beginning in 1987 with the installation of the first horizontal plating line, for permanganate desmear, at a PCB maker in Germany. Horizontal plating has undergone its share of advances since. The basic concept, however, has never changed, and today there are more than 130 lines installed at PCB manufacturers around the world. 1991 saw the introduction of horizontal electroless copper systems. Based on the total installed capacity per country, Taiwan could be called the center of horizontal plating. Taiwanese PCB makers have installed about 50 lines, and horizontal plating is the technology of choice of almost all top Taiwanese PCB shops. Among the first customers was one leading Taiwanese PCB producer; since its first electroless copper installation, in 1991, it has added 10 lines, with 41 plating modules, at plants in Taiwan and China, making it the clear leader in horizontal plating capacity in the world.
机译:水平电镀的起源是“低调”,始于1987年,当时在德国的PCB制造商安装了第一条用于高锰酸盐去污的水平电镀线。从那以后,卧式电镀取得了进步。但是,基本概念从未改变,如今,全球PCB制造商已安装了130多条生产线。 1991年推出了卧式化学镀铜系统。根据每个国家的总装机容量,台湾可以称为水平电镀中心。台湾PCB制造商已经安装了大约50条生产线,而水平电镀是几乎所有台湾顶级PCB商店的首选技术。首批客户中有一家台湾领先的PCB生产商。自1991年首次进行化学镀铜以来,它已在台湾和中国大陆的工厂增加了10条生产线和41个电镀模块,使其成为全球水平电镀能力的明显领导者。

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