The Impact of Innerlayer COPPER FOIL ROUGHNESS on Signal Integrity

摘要

One of the great things about the electronics industry is that there is constant and sometimes rapid change across many aspects of the business. The changes I am referring to generally fall into two categories: cost driven changes and performance driven changes. Both of these drivers can manifest themselves in many different ways. Though PCBs are basically the same structures they have been since their early days, i.e. traces and holes that interconnect numerous components and connectors that are mounted to them, the methods used to fabricate PCBs, the materials used and performance requirements that must be met have changed dramatically over the last decade.