A typical surface mount process consists of three major process steps: solder paste deposition, pick-and-place and reflow. Solder paste deposition can be performed by two different methods: printing or dispensing/jetting. Printing is the method of choice when possible, due to its higher throughput rate. Dispensing is used only when a small number of components are present on a printed circuit board, or when printing is not possible due to board design complexity. Recent product miniaturization breakthroughs have pushed stencil printing solder paste to its current process limits. Many handheld devices such as cellphone boards contain miniature devices such as 01005 passives to 0.4mm pitch packages, along with RF shields and large connectors.
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