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Tin Whisker Mitigation on New and Stored Parts

机译:缓解新旧零件上的锡须

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摘要

When mitigating and managing tin whisker risk, consider two distinct points in the product cycle. One is a new system with zero-storage life. Another (often overlooked) point is the time spent in storage before active service begins. There can be a loss of service life and an increase in system failures caused by tin whiskers that grow while a system is in storage prior to activation. This affects spare parts, backup systems and repair parts. The risk of failure with tin whiskers is usually associated with Sn-coated parts, Pb-free solders and components. If the assembly does not have pure tin component finishes and uses eutectic SnPb solder, tin whiskers are not usually a concern.
机译:减轻和管理锡须风险时,请考虑产品周期中的两个不同点。一种是具有零存储寿命的新系统。另一个(通常被忽略)的点是主动服务开始之前在存储上花费的时间。锡晶须在激活之前存储在系统中时会增加,从而可能会导致使用寿命缩短和系统故障增加。这会影响备件,备用系统和维修部件。锡晶须失效的风险通常与镀锡零件,无铅焊料和组件有关。如果组件没有纯锡组件表面处理并使用共晶SnPb焊料,则通常不需要考虑锡晶须。

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  • 来源
    《Printed Circuit Design & Manufacture》 |2012年第3期|p.36-37|共2页
  • 作者

    ACI TECHNOLOGIES;

  • 作者单位

    Center of Exc ellence in Electronics Manufacturing, specializing in manufacturing services, IPC;

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  • 正文语种 eng
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