IC Package Pitch Headed Widely to 0.4mm

摘要

A new study of trends in IC packaging says 0.5mm pitch will remain mainstream for years to come. When comparing total packages, 0.4mm pitch will grow fastest, from 1.7% of the market in 2012 to 10.1% by 2017, New Venture Research says. Nevertheless, 0.5mm pitch will remain the most common size used, growing from 37.3% in 2012 to 47.3% growth in 2017. Growth is also seen for 0.3mm pitch, which will rise with an effective 0% share in 2012 to 4.9% in 2017.