Power electronics packages with Embedded Components - Recent Trends and Developments

摘要

Over the last couple of years, the chip embedding technology has gained huge interest for manifold application. Meanwhile, different products in low- and medium-power applications are commercially available. In a German-funded research project, HI-LEVEL partners from industry and research are developing a next generation of automotive power electronics using PCB embedding technology. A 10kW power module with embedded IGBTs and diodes has been realized. The manufacturing of such modules is based on printed circuit board technologies. The first electrical tests have shown the functionality of the module. Long-term power cycling tests still have to be performed. The final goal is the manufacturing of a 50kW inverter for an electrical hybrid car. It is expected that embedded technology can fulfill the demanding requirements on electronics for the future of fully electric vehicles.