CSPs to Show 7% CAGR for 2017-22

摘要

The latest chip-scale package market forecast shows a 7% CAGR from 2017 to 2022, with one of the strongest growth categories being the quad flat no-lead (QFN) package, with a CAGR of 8.8%, according to TechSearch International. Demand for cryptocurrency devices is expected to increase flip-chip CSP and BGA volumes this year. Few foundries and OSATs are willing to add capacity for cryptocurrency because of its unpredictability, but those that did are enjoying the windfall, according to the firm. Projections for PC growth are flat, and shipments of smartphones show low growth rates.