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Laminate Characterization Measurement Testing

机译:层压板特性测量测试

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THIS IS PART three in a series that examines how the industry at-large characterizes laminates. It's true such things are of little interest below 1GHz, but I suspect the relative comfort of the sub-GHz world has slipped into the distant past for many of us. Part Ⅰ summarized the "anarchy" that permeates this part of the PCB design world. Part Ⅱ, last month's column, pointed out a dozen different "standards" can be used to characterize Dk and Df. In fact, there's little evidence to suggest the standardization process has led the industry to true standards. To me, "standard" means that if I measure something in Taipei, Tokyo, Toulouse or Toronto, I'm going to get pretty close to the same result if I follow a "standard" test method. That's not what we have. Here in Part Ⅲ, we'll focus primarily on the electric-field (E-field) orientation of the measurement equipment.
机译:这是本系列的第三部分,该系列探讨了整个行业如何表征层压板。的确,在1GHz以下这些东西没什么意义,但是我怀疑在我们许多人看来,低于GHz的世界的相对舒适度已经滑入了遥远的过去。第一部分总结了遍及PCB设计世界这一部分的“混乱状态”。第二部分是上个月的专栏,指出了十多种不同的“标准”可用于表征Dk和Df。实际上,几乎没有证据表明标准化过程已使业界达到了真正的标准。对我而言,“标准”是指如果我在台北,东京,图卢兹或多伦多进行测量,那么如果我遵循“标准”测试方法,我将获得接近相同的结果。那不是我们所拥有的。在第三部分中,我们将主要关注测量设备的电场(电场)方向。

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