NEWLY DEVELOPED MICRO-INDENTATION AND SCRATCH TESTER FOR MEASURING SUB-SURFACE DAMAGED LAYER

摘要

The micro-indentation and micro-scratch device is newly developed for trial purposes aiming to evaluate the mechanical characteristic of the material surface layer by a precision machining or a micro-processing. The device enables us to precisely measure an indentation load-depth curve, and to determine the micro-hardness, the micro-scratch hardness and friction coefficient of a subsurface damaged layer and a thin film layer of 1μm or less with the same equipment. It is found that the depth profile of the micro-hardness characterizes the thickness of a stress hardening layer of a diamond cutting surface, and that the friction coefficient of a mono-crystal silicon is different from a silicon oxide thin film.