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Investigation of an overvoltage protection for fast switching silicon carbide transistors

机译:快速开关碳化硅晶体管的过压保护研究

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摘要

Transistors made of wide band-gap materials such as silicon carbide (SiC) offer the opportunity of much faster switching, and, hence, lower switching losses compared with silicon (Si) devices. To utilise the full potential of SiC-devices the influence of stray inductances and capacitances on the switching behaviour has to be minimised. Stray inductances result in overvoltages possibly destroying the transistor at turn-off. These overvoltages can be avoided by protective circuitries such as active clamping or dynamic voltage rise control without sacrificing the fast switching. Such circuitries are well-known from Si-transistor drivers and are used in cases where stray inductances cannot be reduced any further. All investigations of the overvoltage reduction by the dynamic voltage rise control (DVRC) were performed for one SiC-BJT and two SiC-MOSFETs from different manufacturers. If the DVRC would behave in a similar way such as for silicon IGBTs, the benefit would be huge: Overvoltages would be reduced and the switching speed could be increased. However the influence of parasitic components has to be considered for the protective circuitry as well.
机译:由宽带隙材料(例如碳化硅(SiC))制成的晶体管提供了更快的开关机会,因此与硅(Si)器件相比,开关损耗更低。为了充分利用SiC器件的潜力,必须将杂散电感和电容对开关性能的影响降至最低。杂散电感会导致过电压,可能会在关断时损坏晶体管。这些过电压可以通过保护性电路来避免,例如有源钳位或动态电压上升控制,而不会牺牲快速开关。这样的电路从Si晶体管驱动器是众所周知的,并且用于不能进一步减小杂散电感的情况。通过动态电压上升控制(DVRC)对过电压降低的所有研究均针对不同制造商的一种SiC-BJT和两种SiC-MOSFET。如果DVRC以类似于硅IGBT的方式工作,那么好处将是巨大的:将减少过压并可以提高开关速度。但是,对于保护电路也必须考虑寄生元件的影响。

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